Put vias under component. Make bottom copeer pad large, and you have much better heatsink capabilites.
Make via also untinted ut botom, so you can fill it with solder. For my taste your trace to via...
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Re: Determining trace/via/wire current capability
I understand that you use Eagle.
Ioannis Today, 10:09How can you prevent solder mask at the area of the VIAS under the smd component?
Ioannis