FYI, part baking is required for parts used in IR solder systems, if they have been unsealed for a certain length of time. Any moisture in the part could cause case cracking when that part is raised to 260C very quickly, as is done in an IR soldering system.

As for drying boards after cleaning, they could be air dried without any problems, if you have the time. Oven drying is really only necessary if you are planning to conformal coat the boards or if you need them dry real quick. Time is money on an assembly line.