Hi Steve,
The moisture problem seem to be moisture creeping into the package. During the IR or Reflow soldering process, the heat turns the moisture into steam. The steam explodes the package integrity. Using the components in a outside environment (after assembly) looks like it is not so much of a problem.
Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount DevicesData Sheet
jedec level 4 moisture sensitivity
http://www.jedec.org/download/search/jstd020c.pdf]
The data sheet also says:Pasted from web
Delamination and package cracks during IR solder re flow are the predominant failure modes.
Solder heat is a major cause of early and future failure. Please pay attention to your soldering process.
I would think about your soldering process, to see if it might be overheating the device.
-Adam-
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