Just an update... I've been using the new 16F690 in the (Yikes!) QFN (QLP)package. The convection oven works great, but I tried a technique someone may have posted here. I fluxed the board and IC pads, aligned it with a tweezer, and used a soldering iron with a relatively large ball of molten solder on it. Of course, the fine solder traces shorted with solder here and there as I moved the iron around the chip. When I was sure all pads and traces were coated with solder, I placed some very fine solder wick against the chip where the pads meet the PCB traces. I heated it with the solder iron, and low and behold, it pulled off all of the extra solder! I had the IC perfectly soldered in under a minute! If you haven't tried this technique, I highly reccomend it. I am actually looking forward to the next fine pitch surface mount build I have coming up.

Cheers,
Ron