Put vias under component. Make bottom copeer pad large, and you have much better heatsink capabilites.
Make via also untinted ut botom, so you can fill it with solder. For my taste your trace to via are too small(I know it is only signal, but...).
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Put vias under component. Make bottom copeer pad large, and you have much better heatsink capabilites.
Make via also untinted ut botom, so you can fill it with solder. For my taste your trace to via are too small(I know it is only signal, but...).
![]()
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