If you use a QFN package you WILL have trouble soldering it unless you use a reflow oven or hotplate. The QFN package has no exposed leads. Just pads underneath the chip.
Unless you have some particular reason for the QFN package, I might recommend the TQFP package instead. That has leads you can actually see and solder if you have a little skill and a good iron. A reflow oven is still easier though...
Steve
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